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Reduce Your Die Attach Costs by Up to 60%!
and Stay Ahead with Industry-Leading Performance
Over 25 years of proven excellence in die attach engineering and precision assembly solutions
maximize production Reduce maintenance, minimize downtime
We are committed to delivering best-in-class systems and application support
Reduce Your Die Attach Costs by Up to 60%!
and Stay Ahead with Industry-Leading Performance
Over 25 years of proven excellence in die attach engineering and precision assembly solutions
maximize production Reduce maintenance, minimize downtime
We are committed to delivering best-in-class systems and application support
Contact us
Reduce Your Die Attach Costs by Up to 60%!
and Stay Ahead with Industry-Leading Performance
Get a personalized demonstration and discover how we can revolutionize your production efficiency.
The MAT 6200 and 6500 Die Attach Systems
Model 6500
Automatic, High Accuracy Die Attach System
Model 6500 – High Accuracy Meets Ultimate Versatility
The MAT Model 6500 Automatic Die Attach System is a high-precision, fully automated platform designed for Face-Up and Flip-Chip applications across a wide range of processes — including Epoxy, Eutectic, C2/C4, Ultrasonic, ACF/ACP, Silver Glass, UV Adhesives, and Ag Sintering.
Combining industrial performance, advanced automation, and a large work area, the 6500 is the ultimate solution for high-end die attach applications in MCM, RF, MEMS, hybrid, and imaging devices.
Key Advantages
- High Precision Performance: Servo-driven motion systems and digital vision deliver placement accuracy better than ±3 µm, with throughput up to 1000 CPH.
- Large Work Area: Supports substrates up to 20” × 12” while maintaining compact system size (1.2 m² footprint).
- Full Process Versatility: Switch seamlessly between Epoxy, Eutectic, C2/C4, ACF/ACP, and Ag Sintering processes — all built-in and software-selectable.
- Advanced BLT Control: Programmable Bond Line Thickness (BLT) management with height measurement and precision better than 5 µm, independent of adhesive volume.
- Flexible Material Handling: Works with 300 mm wafers, 40 waffle/gel packs, 8 tape & reel feeders, and unusual die aspect ratios.
- Comprehensive Flip-Chip Capability: Chip flipping, bump fluxing, precision alignment, and underfill processes using a high-resolution up-looking camera.
- Wide Process Range: Supports Gold-to-Gold Interconnect (GGI) up to 130 kHz and 40 W, thermo-compression up to 90 N and 500 °C, and local die heating for eutectic MCM bonding.
- Thin & Large Die Handling: Dual-stage ejection system for delicate dies — from 150 µm to over 50 mm, down to 50 µm thickness.
- Smart Process Control: Integrated library for complex adhesive patterns, programmable tool heating, scrubbing motion control, and forming gas option.
- Efficient Design: Weighs 350 kg with deep 50 mm Z-axis travel, offering both precision and stability for complex assemblies
Model 6200
Automatic Die Attach System
Model 6200 – Compact Precision, Unlimited Flexibility
The MAT Model 6200 Automatic Die Attach System delivers high-accuracy, full-process automation in a compact, table-top design.
Engineered for advanced applications such as MCM, MEMS, sensors, imaging devices, flip chip, eutectic bonding, and Ag sintering, it combines industrial-grade performance with ease of operation and a minimal footprint — ideal for both R&D and production environments.
Key Advantages
- High Accuracy & Productivity: Servo-controlled motion with placement precision better than ±3 µm and throughput up to 600 CPH (application dependent).
- Versatile Process Range: Supports MCM, Flip Chip, Eutectic, Silver Glass, Ag Sintering, and multi-chip stacking in a single platform.
- Advanced Vision System: High-resolution digital camera with intelligent image processing ensures repeatable, high-yield results.
- Flexible Dispensing Options: Time-Pressure, Volumetric, or Jet dispensing — with dual dispenser configuration and micro-dot stamping (75 µm).
- Comprehensive Die Handling: Accommodates Waffle/Gel packs, Tape & Reel, Bulk, or mixed feeders for maximum flexibility.
- Flip Chip & High-Temperature Processes: Full C2/C4 support, chip flipping, bump fluxing, precise alignment, and eutectic bonding up to 500 °C with heated tools and forming gas option.
- Compact Table-Top Design: Lightweight system (<200 kg) with 6″ × 6″ work area — suitable for ceramic, silicon, metal, PCB, and other substrates.
The Model 6200 combines precision, reliability, and process versatility — redefining what a compact die attach system can achieve
Contact us
Reduce Your Die Attach Costs by Up to 60%!
and Stay Ahead with Industry-Leading Performance
Get a personalized demonstration and discover how we can revolutionize your production efficiency.
Engineered for Productivity. Built for Reliability. Driven by Precision
- Over 25 years of proven excellence in die attach engineering and precision assembly solutions
- Ensure rapid ROI, Increase productivity, minimize downtime, and reduce maintenance.
- Trusted by hundreds of leading electronics and semiconductor manufacturers across every major industry.
- ISO 9001:2015 certified — guaranteeing world-class quality, safety, and process control.
- Proven process expertise, built through decades of hands-on collaboration with global customers.
Precision. Flexibility. Efficiency — The MAT Advantage
Maximum Savings. Maximum Efficiency.
Reduce die attach operating costs by up to 60% compared to competing systems.
- One modular platform performs all die attach processes — no need for multiple costly machines.
- Exceptional value through precision, speed, and ease of operation.
Unmatched Versatility
- Single platform supports Flip Chip & Face up, Epoxy, Eutectic, Thermo-sonic, Sintering and other technologies large chips, small, active and passive components, and complex bonding.
- Tailor-made flexibility for dynamic industrial requirements.
- Future-proof your investment with modular upgrades.
High Precision for Complex Demands
- Designed for sensitive, high-value applications requiring absolute accuracy.
- Industry-leading accuracy for both small and large chip handling.
- Deliver exceptional quality for complex and precise bonding tasks.
Why choose us?
- Overall solution – machine & tools
- Easy to use, flexible, and reliable tabletop wire bonders
- Application expertise and process optimization
- 24/7 Online Technical support
- Wide Trade-in options
- Extended warranty options
- Global presence
- Over 40 years of experience and know-how
- Silver, Gold, and Platinum service plans
- “Certified Used” MPP machines with warranty
Why Choose Us?
Engineered for Productivity. Built for Reliability. Driven by Precision
- Over 25 years of proven excellence in die attach engineering and precision assembly solutions
- Ensure rapid ROI, Increase productivity, minimize downtime, and reduce maintenance.
- Trusted by hundreds of leading electronics and semiconductor manufacturers across every major industry.
- ISO 9001:2015 certified — guaranteeing world-class quality, safety, and process control.
- Proven process expertise, built through decades of hands-on collaboration with global customers.
Precision. Flexibility. Efficiency — The MAT Advantage
Maximum Savings. Maximum Efficiency.
- Reduce die attach operating costs by up to 60% compared to competing systems.
- One modular platform performs all die attach processes — no need for multiple costly machines.
- Exceptional value through precision, speed, and ease of operation.
Unmatched Versatility
- Single platform supports Flip Chip & Face up, Epoxy, Eutectic, Thermo-sonic, Sintering and other technologies large chips, small, active and passive components, and complex bonding.
- Tailor-made flexibility for dynamic industrial requirements.
- Future-proof your investment with modular upgrades.
High Precision for Complex Demands
- Designed for sensitive, high-value applications requiring absolute accuracy.
- Industry-leading accuracy for both small and large chip handling.
- Deliver exceptional quality for complex and precise bonding tasks.
Global Excellence. Certified Quality. Continuous Support
Global Support & Personalized Service
- Full installation, training, and comprehensive onboarding.
- Tailor-made Pick & Place tools precisely matching your requirements.
- Worldwide service presence ensuring your continuous operation.
Built on Quality. Trusted Worldwide
- Compliant with ISO and strict international quality standards.
- Proven reliability across hundreds of global electronics manufacturers.
- Robust design meets demanding automotive, aerospace, and defense industry standards.
Modular Flexibility
- Customize your setup effortlessly according to changing market needs.
- Easy and affordable upgrades – no replacement machines required.
Who we are
MicroAssembly Technologies (MAT), founded in 2000, is a leading developer and manufacturer of advanced high-accuracy die attach systems for the microelectronics industry. Leveraging deep engineering expertise and decades of field experience, MAT delivers proven, high-performance solutions for complex applications such as Multi-Chip Modules (MCMs), MEMS, sensors, imaging devices, and Flip-Chip assemblies.
Our flagship Model 6500 and Model 6200 systems provide exceptional precision, flexibility, and throughput, supporting both R&D and high-volume production environments.
With a global customer base and ISO 9001:2015 certification, MAT is committed to innovation, reliability, and continuous collaboration, ensuring optimized process performance and long-term customer success.
Contact us
Reduce Your Die Attach Costs by Up to 60%!
and Stay Ahead with Industry-Leading Performance
Get a personalized demonstration and discover how we can revolutionize your production efficiency.
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